SENKO: Illuminating Global Opportunities with Local Impact
At SENKO, our commitment to advancing optical interconnect solutions spans decades, rooted in innovation, customer collaboration, and a deep understanding of the ever-evolving fibre ecosystem. With over 1,000 patents and a presence in more than 17 countries, SENKO delivers cutting-edge connectivity from the first nanometer to the last mile, empowering networks across APAC and the globe.
SENKO’s Contribution to Global and APAC Fibre Connectivity
SENKO has played a key role in shaping the modern fibre landscape. From pioneering Very Small Form Factor (VSFF) connectors to supporting the deployment of high-speed networks in diverse environments, from hyperscale data centers to rural broadband rollouts, our solutions are engineered for reliability and scale. In the APAC region, we continue to expand our footprint with technical support, regional warehousing, and collaborative engagement tailored to local market needs.
Recent Innovation: Hybrid Optical and Electrical Connectors
One standout innovation is our IP-ONE Hybrid Series, a connector that combines fibre and power in a single ruggedized interface. Designed for outdoor and edge applications, this technology addresses one of the industry’s most persistent challenges, how to deliver data and power over long distances without complex engineering. This solution is particularly impactful in regions like Southeast Asia where remote connectivity and smart infrastructure deployments are growing rapidly.
State of the Fibre Industry in APAC
The APAC fibre market is entering a dynamic growth phase, driven by national digitalisation strategies, 5G rollouts, and smart city initiatives. Countries such as India, Vietnam, and the Philippines are accelerating deployments, while mature markets like Japan, South Korea and China are pushing toward next-gen data centre and low latency networks & architectures for application such as Quantum Communication, High power transmission suitable for transcontinental and submarine cable systems .
At SENKO, we’re seeing increased demand for rugged, modular, and high-density connectivity to support this evolution with also new fibre technologies such as hollow fibre trials on the on the rise in APAC leading the pathways of low latency networks globally.
Opportunities and Challenges in the Next 5–10 Years
As fibre becomes the digital backbone of AI, IoT, and cloud applications, APAC faces both infrastructure opportunities and workforce challenges. The need for scalable solutions and rapid deployment will be key. SENKO is investing in connector platforms that simplify installation while supporting evolving standards such as Co-Packaged Optics and 800G/1.6T technologies. A major challenge will be ensuring interoperability and sustainability in increasingly complex networks.
SENKO’s Unique Insight into Infrastructure Deployment
With our deep expertise in connector design, SENKO brings a critical advantage to infrastructure rollouts, connector-level reliability and performance. In APAC’s diverse terrains and climates, from coastal cities to inland villages, our IP-rated and tool-less connectivity solutions ensure uptime and ease of deployment. Our “global presence, local touch” model ensures that we provide fast, responsive support wherever needed.
Introducing the Emerging Technology Group (ETG)
To remain at the forefront of optical innovation, SENKO has launched a dedicated Emerging Technology Group (ETG), led by Kazu Takano, President of ETG. This cross-functional team is focused on next-generation fibre optic connectivity for high-growth areas like Co-Packaged Optics (CPO), photonic integration, and future-proof backplane and mid-board interfaces.
At OFC, SENKO unveiled its 36-channel metallic PIC connector with an innovative detachable Precision Alignment Device (PAD), which earned a 4.5/5 score in the Lightwave Innovation Awards.
“With AI and machine learning transforming the industry, the technology needed to enable the next phase. CPO is vastly different from the past,” said Kazu Takano. “The ETG is investing in advanced fibre connectivity that allows customers to evolve and scale. We’re building solutions that span from Fibre-To-The-PIC to the mid-board, to the front panel, and covering the full signal path from the first nanometer to the last mile.”
Case Study: Enabling Rural Connectivity in Southeast Asia
In collaboration with a leading service provider, SENKO helped deliver FTTx to a rural island community in Indonesia. Using our pre-terminated solutions and hybrid connectors, the deployment time was cut in half while ensuring IP68 protection against harsh tropical conditions. This project exemplified how fibre can transform education, commerce, and healthcare even in isolated communities.
Driving Innovation through Collaboration
SENKO actively engages with transceiver manufacturers, system integrators, solution providers, and standardization bodies to co-develop future-ready solutions. Through industry alliances and councils such as the Fibre Network Council APAC, we help guide market direction and ensure our products meet both current and anticipated demands.
Advice for Accelerating Fibre in Underserved Areas
Governments and private stakeholders must prioritize simplified infrastructure models. This includes adopting modular plug-and-play solutions, training local technicians, and leveraging hybrid fibre-power technologies that reduce dependency on traditional electrical grids. SENKO offers extensive support to help close the digital divide.
The Future of Fibre in APAC
Over the next decade, APAC’s fibre infrastructure will be defined by resilience, convergence, and intelligence. Networks will need to handle extreme data loads, self-heal, and support both centralized and edge computing. SENKO is investing in innovations that meet this future, ensuring our connectivity solutions are ready to support the demands of tomorrow’s world.
Celebrating 1 Billion Connectors and Looking Ahead
In 2025, SENKO proudly marked the milestone of selling its one billionth connector. From long-haul and FTTH to antenna and AI data center applications, this achievement reflects decades of customer partnership and product evolution. As we look to the next billion, SENKO remains committed to delivering intuitive, high-performance solutions like the EZ-Way LC and MPO connectors, which are redefining patch panel usability in high-density environments.
SENKO: Global Presence, Local Touch – We Follow the Sun, Illuminating Opportunities
With an engineering-led culture and customer-first approach, SENKO is uniquely positioned to lead in the fibre connectivity space. As global networks expand and digitization accelerates, SENKO stands ready to support partners across APAC and beyond with innovative, scalable, and trusted interconnect solutions.
To explore more about SENKO’s capabilities, visit www.senko.com
Watch the SENKO Corporate Video here:
